SanDisk announced the construction of the phase two shell of the Fab 5 joint venture wafer fabrication facility.

With expected completion in mid-2014, SanDisk Corporation has announced that the construction of the phase two shell of the Fab 5 joint venture wafer fabrication facility located in Yokkaichi, Japan,
will begin in August 2013.

Due to a set realities, SanDisk expects to use phase two of Fab 5 primarily for technology transitions of existing Yokkaichi wafer capacity.

We also learn that, the new cleanroom will provide the space needed for additional equipment required for transitioning the wafer capacity in Fab 3, Fab 4 and phase one of Fab 5, to next generation 2D NAND technologies and to early generations of 3D NAND technology.

In addition, Fab 5 will have an earthquake absorbing structure and is designed to minimize environmental impact.

About SanDisk

SanDisk Corporation (NASDAQ: SNDK) is a global leader in flash memory storage solutions, from research and development, product design and manufacturing to branding and distribution for commercial and retail channels. Since 1988, SanDisk's innovations in flash memory and storage system technologies have provided customers with new and transformational digital experiences. SanDisk's diverse product portfolio includes flash memory cards and embedded solutions used in smart phones, tablets, digital cameras, camcorders, digital media players and other consumer electronic devices, as well as USB flash drives and solid-state drives (SSD) for the computing market.