Showing posts from March 23, 2017

The results of 2017 DevSecOps Community Survey

I have a pleasure to recall that, DevOps is not an excuse to do application security poorly; rather it is an opportunity to do application security better than ever. Development plays an active, early role in application security.For DevOps teams, security controls are increasingly automated throughout the development lifecycle. Automated security practices allow developers to keep pace with the speed and scale of innovation. According to Sonatype, via the results of its 2017 DevSecOps Community Survey, IT organizations continue to struggle with breaches as nearly a 50% increase was recorded between Sonatype’s 2014 and 2017 survey. 
The survey also reveals that, organizations everywhere are now transforming their development from waterfall-native to DevOps-native tools and processes. Where traditional development and operations teams see security teams and policies slowing them down (47%), DevOps teams have discovered new ways to integrate security at the speed of development. Only 28% …

Here is how the application processors (AP) are packaged using Package-on-Package (PoP) technology

I have pleasure to recall that, located under the DRAM chip on the main board, the application processors (AP) are packaged using Package-on-Package (PoP) technology. The Apple A10 can be found in the iPhone 7 series. The HiSilicon Kirin 955 can be found in the Huawei P9 and the Samsung Exynos 8 as the Qualcomm Snapdragon 820 can be found in the Samsung Galaxy S7 series depending on the world version (US and Asia for the Snapdragon and International for the Exynos).

Major players are sharing the smartphone application processors (AP) market

Steadily and surely, five major players are sharing the smartphone application processors (AP) market. Among them, Qualcomm, Apple, Samsung and HiSilicon propose the most powerful AP.
One can observe that, they use almost the same technology node for the die, and the innovation is now at the packaging level. During 2017, Research and Markets observed different technologies inside the four main smartphone flagships: classic Package-on-Package (PoP) developed by Amkor for the Kirin 955 and for the Exynos 8, Molded Core Embedded Package (MCeP) technology developed by Shinko for the Snapdragon 820 and integrated Fan-Out packaging (inFO) developed by TSMC for the A10.

Application Processor Packaging Technical Comparison Analysis

In our ever mobile-driven era, it is clear that, there are the differences and the innovations of the packages chosen by the end-user OEMs. Whereas some AP providers like for HiSilicon or Samsung choose to consider conventional PoP with embedded land-side capacitor (LSC), others like Apple or Qualcomm use innovative technologies like Fan-Out PoP and silicon based Deep Trench LSC or embedded die packaging with advanced PCB substrate.