China Hi-Tech Fair ELEXCON 2013: Toshiba to Showcase Leading-edge Semiconductor Solutions.
For those who unfamiliar, China Hi-Tech Fair ELEXCON 2013 will run from
November 16 to November 21 at the Shenzhen Convention Center (SZCEC), Toshiba’s
booth will be at Hall 2-2D67.
During the event, Toshiba will highlight solutions in five areas:
"Mobile", "Home Appliance", "Industrial",
"Automotive" and "Memory & Storage".
Outline of Toshiba’s Exhibition includes:
1. ‘Mobile:
Solutions for mobile products that use various wireless environments, such
as TransferJet™, NFC, Bluetooth®, Wi-Fi® and wireless charging. Image
processing technologies such as CMOS sensors and interface bridge ICs, and
ultra-small package discrete products will also be showcased.
2. Home
Appliance:
Technologies for realizing an eco-friendly smart life, including lighting
solutions using white LEDs, motor control technologies for low power and low
noise, technologies for improving image resolution in TVs, and surveillance
camera solutions that use image recognition technologies.
3. Industrial:
A line-up of discrete products to realize high efficiency and high
performance will include high power IGBT modules for railroads, power
transmission & distribution and inverter use, SiC devices and GaN devices.
4. Automotive:
Solutions towards realizing safer, more secure driving, including motor
control technologies and high definition full HD image processing technologies.
5. Memory
& Storage:
High capacity memory and storage products that enable users to store all
sorts of data: music, movies, big data for cloud computing and more. The
exhibit will feature products using NAND flash memories including e•MMCTM,
SD memory cards, USB memory, SSD and hybrid drives, as well as HDD. Memory
products with wireless features that enables users to transfer big data at high
speed will also be exhibited, including FlashAir™”, the SDHC memory card with
embedded wireless LAN communications and a TransferJet™ embedded SDHC memory
card’.
