ON Semiconductor has introduced the highest resolution optical image stabilization (OIS) integrated circuit (IC) for use in smartphone camera modules.
The stake here is to deliver industry-leading accuracy and low power
operation in a compact size.
Based on the reality that, there is growing demand for enhanced camera
performance in the latest smartphone models, Connectikpeople can observe that,
the LC898111AXB-MH introduced by ON Semiconductor ,combines both the controller
and driver functionality necessary for dealing with optical image stabilization
(OIS) in the camera modules incorporated into smartphone handsets.
·
It enables precise suppression
control of camera shaking to be achieved,
·
It allows implementation of Pan/Tilt function
indispensable for walk-and-take
situations,
·
The output of the IC’s
integrated pulse width modulated (PWM) driver lowers power consumption as well
as reduces the effect of noise on image quality.
According to ON Semiconductor, ‘’this highly-integrated, program-ready IC
enables engineers to minimize the number of external components necessary in
the system design , thereby reducing overall power consumption and board real
estate utilization’’.
“Handset manufacturers need to
specify higher resolution CMOS image sensors that are supported by greater
degrees of OIS accuracy. This compact, highly-sophisticated, power efficient,
single-chip solution helps in the design of smartphones which are lighter and
sleeker while still being more feature-rich. The innovative LC898111AXB-MH IC
has already been adopted by leading smartphone manufacturers and is currently
in use in the highest resolution smartphone camera on the market today.” said
Tomofumi Watanabe, business unit Leader of the Power Solutions Products in
Intelligent Power Solution Division at ON Semiconductor.
Connectikpeople has also observed that:
·
The LC898111AXB-MH has
numerous built-in digital and analog signal processing mechanisms. These
include a two-channel position sensing circuit, a gyro-filter interface circuit
and lens-servo circuit. The position sensing circuit contains a hall-amp
circuit, constant current digital-to-analog converter (DAC), gain control
operational amplifier and 12-bit analog-to-digital converters (ADCs) for each
channel.
·
The gyro-filter interface
circuit is fully compatible in both analog and digital signals. Both the
gyro-filter interface and lens-servo circuits are adjustable through the I2C
and SPI bus interfaces, allowing comprehensive configuration when connecting
with various gyros and actuators. As a result, the device can cover a wider
shaking frequency range and thus offers a more expansive image stabilization
angle.
·
Further expansion of the
series is planned with the development of the LC898119XC-MH which offers the
industry’s smallest chip size measuring 2.0mm X 2.0mm X 0.675mm, while
providing extremely low power consumption; samples are available now.
About ON Semiconductor
ON Semiconductor (Nasdaq: ONNN) is driving energy efficient innovations,
empowering design engineers to reduce global energy use. The company offers a
comprehensive portfolio of energy efficient power and signal management,
logic, discrete and custom solutions to help customers solve their unique
design challenges in automotive, communications, computing, consumer,
industrial, LED lighting, medical, military/aerospace and power supply
applications. ON Semiconductor operates
a responsive, reliable, world-class supply chain and quality program, and
a network of manufacturing facilities, sales offices and design centers in key
markets throughout North America, Europe, and the Asia Pacific regions. For more information, visit http://www.onsemi.com.
