The next generation Intel® Xeon Phi™ processor ("Knights Landing").

During the Supercomputing Conference in Denver, Intel discussed form factors and memory configuration details ; and Connectikpeople has discovered that the new design will be based on the leading edge 14nm manufacturing technology and will be available as a host CPU with high-bandwidth memory on a processor package.

Bringing many-core CPU, Intel announced that, it will be more easily programmable for developers and improve performance by removing "off-loading" to PCIe devices, and increase cost effectiveness by reducing the number of components compared to

current solutions.

In the same dynamic, Intel has also announced collaboration with the HPC community designed to deliver customized products to meet the diverse needs of customers, and introduced new Intel® HPC Distribution for Apache Hadoop and Intel® Cloud Edition for Lustre software tools to bring the benefits of Big Data analytics and HPC together.