3D optical microscopes: Bruker Corporation Launched ContourSP 3D Optical Microscope.



This is official since yesterday HDI/MCM PCB manufacturers can henceforth relies on the ContourSP 3D Optical Microscope which aims to double the measurement throughput of the high-density interconnect (HDI) substrates in multi-chip modules (MCM) over previous generation SP models used by the semiconductor packaging
industry.
It can measure each layer of the printed circuit board (PCB) panels during manufacturing.  Bruker Corporation promises the minimum recipe development time, highest yield, maximum up-time, and lowest cost per measured panel in production.
The new Vision64® operator interface accommodates multi-processing features, multi-region analysis, automatic re-measurement, and Dynamic Signal Segmentation (DSS) analysis.

About ContourSP
Based on white light interferometry, the ContourSP incorporates decades of packaging and panel measurement experience to provide unprecedented speed, metrology capability, reliability, serviceability, and manufacturing readiness for 3D critical dimension measurements in MCM and HDI PCB applications. Bruker’s high-performance 3D optical microscopes feature Vision64 operating and analysis software, and the industry's most intuitive, modular user interface to deliver user-level-customization capabilities for the widest possible range of surface profiling metrology applications. The ContourSP also utilizes Bruker’s revolutionary gantry-based design and integrated workstation to support up to 600x600-millimeter samples in a highly compact footprint.

About Bruker Corporation (NASDAQ: BRKR)
Bruker is a leading provider of high-performance scientific instruments and solutions for molecular and materials research, as well as for diagnostics, industrial and applied analysis. For more information, please visit
www.bruker.com.

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