Semiconductor packaging

For those who are unfamiliar, Packaging is a process in the semiconductor development cycle that involves the wrapping of the silicon wafer in a case. This case offers support and protection from physical damage as well as prevents the corrosion of the chip. Semiconductor packaging, over the last ten years, has evolved from chip-scale package to SiP, PoP, wafer-level package, 2.5D ICs, and finally to 3D ICs.

According to Technavio Research, the packaging market faces challenges in wafer size and node migrations.